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Bond loan for Label Vie

The General Assembly of the Label Vie Group will authorize at its next annual meeting scheduled on June 13 a bond issue for a maximum amount of MAD 750 million.

This loan may consist of several tranches and will be spread over a period of 5 years.

Note that the company also plans to launch a securitization of part of its real estate assets. The maximum amount is set at MAD 600 million.

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